2 Days
I.D.#97017
Reliability issues can be avoided if engineers from various fields can
develop a mutual understanding of the technical issues facing the
design of an electronics package. This seminar enables engineers
specializing in one area - electronics, packaging (structural and thermal
integrity), thermal, vibration - to better understand and communicate
with other engineers in this area of discipline.
The fields of thermal, vibration, and thermomechanical management
are covered, with discussion on the relevance and applications of each
field. Attendees will also receive a copy of the text “Practical Guide to
the Packaging of Electronics”, by the instructor, Ali Jamnia.
Learning Objectives
By attending this seminar, you will be able to:
Explain the fundamental engineering issues involved in electronics
packaging
Define guidelines for a system’s design - when the design criteria
and components are not fully known
Identify reliability issues and concerns
Conduct more complete analyses for the final designs
Describe the delicate issues involved with electronics packaging and
the interaction of various effects, and thus, fields of engineering
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